Product Design Engineer - DFM SiP / PCBA NPI

Confirmed live in the last 24 hours

Apple

Bengaluru

On-site

Posted March 30, 2026

Job Description

Summary

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Here, you’ll do more than join something — you’ll define something. As a part of SiP process NPI team, you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.

Description

As a DFM SiP/ PCBA NPI engineer, you will play a crucial role in developing next generation SiP process and PCBA assembly process for various of end products. You will be deeply involved from early design phase , prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, you will be the key stakeholder to lead OSAT’s process team for process development & qualification per projects assigned.This role partners closely with cross-functional engineering teams, suppliers, and factory operations to support NPI, equipment development, and high-volume manufacturing while meeting quality, cost, and delivery objectives.

Minimum Qualifications

Bachelors or Masters degree in Mechanical engineering, Physics, Materials Science or equivalent 5 years of experience in IC packaging / Surface Mount Technology / Printed Circuit board assembly process Solid knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials Strong knowledge of SMT Processes, mechanical design, GD&T, Tolerance Analysis

Preferred Qualifications

Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing Proven ability to lead internal or external team for assembly process development and qualification of semiconductor packages Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP) Ability to work under pressure with a wide range of people with varying degrees of experience Familiar with quality tools, including SPC, Cpk, data distribution, data correlation, commonality study and etc Excellent communication skills in English

productdesign