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Senior

Senior / Engineer, Process Engineering (Advanced Packaging)

Confirmed live in the last 24 hours

asm

asm

Singapore
Hybrid
Posted April 16, 2026

Job Description

 

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

Build the foundation of nextgeneration semiconductor technologies.

As a Senior / Engineer, Process Engineering in Advanced Packaging, you will start your engineering career at the heart of semiconductor innovation. Working alongside experienced engineers and scientists, you will help develop, optimize, and characterize thinfilm and surface preparation processes that enable future chip technologies. This role is designed to help you grow—from learning the fundamentals to gradually taking ownership of process modules that directly impact customer success and product performance.

What you will be working on

  • Support the development and optimization of semiconductor processes for advanced packaging applications, including thinfilm deposition (ALD, PECVD, PVD, ECP) and surface preparation 
  • Assist with planning and executing experiments, applying structured problemsolving and basic DOE concepts 
  • Collect, analyze, and document experimental data to support process learning and improvement 
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