Hardware Development Engineer, Transceivers (Starlink)

HARDWARE DEVELOPMENT ENGINEER, TRANSCEIVERS (STARLINK)

At SpaceX we are deploying Starlink, the world's most advanced satellite constellation, to provide broadband internet access to the world. We design, build, and operate all parts of the system – from the hardware in customers' homes to the satellites on orbit. Our engineers are endlessly curious, love to learn, and try out new things. We work collaboratively in a dynamic environment to deliver high-impact technology on a global scale.

As a Hardware Development Engineer for transceivers, you will develop microelectronic failure analysis tools, work with the design and integration teams to develop process and design improvements, and drive corrective actions for improving transceiver reliability. This role encompasses reliability testing of microelectronic devices, failure analysis, statistical process analysis, and collaborating with cross-functional teams to implement reliability improvements from a holistic perspective.

RESPONSIBILITIES:

• Own the overall yield and reliability of transceivers from early production through on-orbit operation
• Interface with adjacent teams to drive reliability improvements for transceivers at all levels
• Develop design, manufacturing, and test requirements for improved reliability of transceiver products
• Scope and procure equipment for testing and analysis of microelectronic assemblies
• Develop standard failure analysis tools and best practices for non-conforming microelectronic devices
• Drive corrective actions and process improvements for transceiver manufacturing (die attach, wire bond, SMT etc.)
• Lead investigation on non-conforming hardware to determine root cause and implement reliability improvements
• Collaborate with design teams and provide design feedback to improve manufacturability and reliability
• Identify trends and opportunities for optimizing product output, quality enhancements, and cost of manufacturability

BASIC QUALIFICATIONS:

• Bachelor’s degree in mechanical engineering, electrical engineering, materials science, physics, or other engineering discipline
• 1+ years of hands-on experience working in microelectronics manufacturing

PREFERRED SKILLS AND EXPERIENCE:

• Advanced technical degree
• 3+ years of experience with manufacturing and testing microelectronics assemblies
• Hands on experience with basic failure analysis tools and methods (shear test, pull test, X-ray, cross-section, SAM)
• Experience with design of experiments (DoE) for process improvements
• Experience with microelectronics manufacturing methods (die attach, wire bond etc.)
• Hands-on experience working in SMT processing and/or related PCBA processes from industry, research, or academic projects
• Experience with MIL-STD-883, IPC-610 and JEDEC standards relative to micro-electronics
• Experience with environmental testing of electronic devices
• Knowledge of statistical analyses and statistical process control
• High volume production experience (consumer goods, automotive, etc.)
• Strong desire and ability to learn quickly, adapt and innovate
• Knowledge of statistical analyses and statistical process control
• Excellent communication skills, both written and verbal
• Ability to work both autonomously and as a team in a highly demanding, fast-paced environment

ADDITIONAL REQUIREMENTS:

• Willing to work weekends and extended hours as needed
• Ability to life heavy objects, up to 25 Ibs. unassisted

COMPENSATION AND BENEFITS: