Senior Engineer, Process Engineering | Global R&D Process Engineering Program

Senior Engineer, Process Engineering | Global R&D Process Engineering Program

As a Senior Engineer, Process Engineering within ASM’s Global R&D Process Engineering Program, you will develop next‑generation semiconductor technologies. For the first 18 to 24 months, you will onboard into a comprehensive development program, combining structured learning with hands‑on work using ASM’s world‑leading semiconductor processing equipment. This phase is designed to accelerate technical depth, process mastery, and integration into ASM’s global R&D community.

Following the initial 18 to 24 months in the Global R&D Process Engineering Program, you will relocate to one of ASM’s state‑of‑the‑art R&D centers in Japan, Korea, or the United States (Arizona) for a permanent role. You will apply the technical depth and process expertise you have developed to advance new technologies at the core of one of ASM’s key business units, working closely with leading scientists, engineers, and product teams to translate innovation into industrial impact.

Take a closer look at the role:

• Work with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Develop innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting, including writing technical papers on advanced process applications and Intellectual Property creation.
• Participate in and drive technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Design and conduct experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoot equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Work directly customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develop methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensure successful product transfer to customer base by performing demonstrations, traveling to support customer sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produce technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.

Qualifications

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
• 0-7+ years of combined education, research, and work experience with:
• Cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
• Materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred

Skills