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Senior

Senior Linux BSP Engineer

Confirmed live in the last 24 hours

Faraday Future

Faraday Future

Compensation

$135,000 - $160,000

Gardena, California, United States
On-site
Posted March 9, 2026

Job Description

The Company:

Faraday Future (FF) is a California-based mobility company, leveraging the latest technologies and world’s best talent to realize exciting new possibilities in mobility. We’re producing user-centric, technology-first vehicles to establish new paradigms in human-vehicle interaction. We’re not just seeking to change how our cars work – we’re seeking to change the way we drive. At FF, we’re creating something new, something connected, and something with a true global impact.

Your Role:

We are seeking an experienced Senior Linux BSP (Board Support Package) Engineer to lead the development and integration of a new hardware platform based on Qualcomm’s latest Snapdragon Automotive chipset. In this role, you will collaborate with our hardware vendor (who provides the initial Linux bring-up) and take ownership of extending, customizing, and validating the BSP for our specific vehicle configuration. You will enable key peripherals (Display, Camera, Ethernet, Serializer/Deserializer chipsets), integrate with Android Automotive OS, and ensure reliable communication with the vehicle’s on-board MCU for system power management and inter-processor communication. This is a senior-level, hands-on engineering position with significant influence on system architecture, debugging strategies, and technical direction. 

Responsibilities: 

  • Lead BSP Development & Board Bring-up 
    • Own the customization of the Linux BSP provided by the hardware vendor. 
    • Guide peripheral bring-up and ensure robust hardware/software integration. 
    • Mentor junior engineers in Linux kernel and driver development. 
  • Peripheral Enablement & Integration 
    • Bring up and configure peripherals such as Display, Camera, Ethernet, SerDes chipsets. 
    • Develop, modify, and maintain Linux device drivers for custom hardware. 
    • Validate integration with Android Automotive OS and ensure compliance with vehicle requirements. 
  • MCU & Power Management Integration 
    • Design and validate communication with the on-board MCU over SPI/UART/GPIO. 
    • Support power-up, shutdown, suspend/resume sequencing between CPU and MCU. 
    • Ensure reliability in real-world automotive scenarios. 
  • Debugging & Validation 
    • Perform in-depth kernel-level debugging using JTAG, serial console, oscilloscope, and logic analyzer. 
    • Define and execute validation procedures for BSP and peripheral bring-up. 
    • Collaborate cross-functionally with hardware vendors, Android application teams, and MCU firmware teams. 

Basic Qualifications:

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field. 
  • 7+ years of experience in embedded Linux BSP development. 
  • Proven expertise in Linux kernel, device drivers, and board bring-up. 
  • Experience with peripheral bring-up: display (DSI), cameras (CSI), Ethernet, SerDes
  • Strong experience with Qualcomm Snapdragon SoCs (automotive or mobile) or other ARM-based SoCs. 
  • Proficiency in C/C++, Linux/Android build systems. 
  • Hands-on debugging experience with oscilloscope, logic analyzer, JTAG, and serial tools. 
  • Understanding of Android Automotive OS HALs and system integration. 
  • Strong analytical and problem-solving mindset for complex system-level challenges. 
  • Technical leadership with the ability to mentor and guide peers. 
  • Effective communicator for cross-functional collaboration and vendor engagement
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