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Overview
Mid-Level

Industry Product Specialist(Semiconductor Packaging Technology)

Confirmed live in the last 24 hours

PatSnap

PatSnap

Singapore
Hybrid
Posted April 24, 2026

Job Description

Position Overview 

Provide professional support for technical deconstruction, process knowledge graph construction, and product evaluation in the advanced packaging domain, with focus on 2.5D/3D packaging, TSV (Through-Silicon Via), and Hybrid Bonding.

aiproduct

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