Microelectronics Process Engineer, Optical Products (Starlink)

MICROELECTRONICS PROCESS ENGINEER, OPTICAL PRODUCTS (STARLINK)

At SpaceX we are deploying Starlink, the world's most advanced satellite constellation, to provide broadband internet access to the world. We design, build, and operate all parts of the system – from the hardware in customers' homes to the satellites on orbit. Our engineers are endlessly curious, love to learn and try out new things, and work collaboratively across disciplines in a dynamic environment to deliver high-impact technology on a global scale.

As a Microelectronics Process Engineer for Optical Products, you will develop cutting-edge manufacturing processes for next-generation electro-optic devices which are critical to the success our satellite constellation. You will work closely with design teams (electrical/mechanical), software teams, equipment vendors, and production technicians to take products from NPI to high volume manufacturing. This role covers microelectronics manufacturing processes such as die attach, wire-bond, AOI, and active alignment.

RESPONSIBILITIES:

• Manage new product introduction and develop production processes for Micro-E assemblies
• Work with machine vendors to procure, maintain, and improve device manufacturing equipment
• Design and execute DOE to optimize production processes for high volume and high reliability
• Collaborate with design teams and provide design feedback to improve manufacturability and reliability of opto-electronic devices
• Lead investigation on non-conforming hardware to determine root cause and implement reliability improvements
• Work with factory automation teams to bring development processes to high volume production and track product outcomes.
• Identify trends and opportunities for optimizing product output, quality enhancements, and cost of manufacturability
• Drive corrective actions and process improvements on owned processes and products
• Create work instructions, SOPs, and administer training for production technicians

BASIC QUALIFICATIONS:

• Bachelor’s degree in electrical engineering, mechanical engineering, materials science, physics, or other engineering discipline
• 1+ years of hands-on experience working with microelectronics assembly equipment

PREFERRED SKILLS AND EXPERIENCE:

• Advanced technical degree
• 3+ years of hands-on experience with microelectronics manufacturing processes (die/wire bonding), SMT, or silicon packaging
• Hands-on experience with electro-optical device manufacturing
• High volume production experience (consumer goods, automotive, etc.)
• Hands-on experience working in SMT processing and/or related PCBA processes from industry, research, or academic projects
• Experience with MIL-STD-883, IPC-610 and JEDEC standards relative to micro-electronics
• Experience with environmental testing of electronic devices
• Strong desire and ability to learn quickly, adapt and innovate
• Knowledge of statistical analyses and statistical process control
• Experience with design of experiments (DoE) for process improvements
• Experience with basic failure analysis tools and methods (shear test, pull test, X-ray, cross-section, SAM)
• Excellent communication skills both written and verbal
• Ability to work both autonomously and as a team in a highly demanding, fast-paced environment

ADDITIONAL REQUIREMENTS:

• Ability to life heavy objects, up to 25 Ibs. unassisted
• Willing to work weekend and extended hours as needed

COMPENSATION & BENEFITS: