Senior Technician -Process (AOI)

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Job Description:

The AOI Process Technician is responsible for programming, maintaining, and optimizing Camtek AOI inspection systems to support Panel Level Packaging process. The role ensures high‑accuracy defect detection, low false‑call rates, and stable inspection performance for fine‑pitch, high‑density interconnect products. Close collaboration with Process Engineering, Quality, and Production teams is required to maintain yield, reliability, and customer quality expectations.

• Create and optimize AOI recipe, imaging parameters, lighting, and thresholds
• Improve inspection consistency across different copper and Tin finishes, substrate types, and solder alloys and flux residues
• Support yield improvement and escape prevention initiatives
• Participate in process window development and control plan definition
• Provide AOI input during NPI, DOE, and process qualification activities
• Identify inspection gaps and recommend corrective actions
• Generate OCAP‑driven inspection reports and defect trend analysis
• Maintain AOI documentation, golden boards, inspection standards, and SOPs
• Comply with quality systems and customer requirements affecting product quality.
• Participate in audits, evaluations, and continuous improvement activities (e.g., 5S, Kaizen).
• Follow company safety policies and support environmental, health, and safety programs.
• Properly use personal protective equipment (PPE) and adhere to cleanroom protocols.
• Immediately report any unsafe conditions, incidents, or near misses.

Requirements/Qualifications:

Technical diploma or degree in:

• Electronics Technology or Engineering
• Semiconductor Manufacturing
• Mechatronics
• Industrial or Electrical Engineering or similar field

Minimum of 2 to 5 years experience in the electronics or semiconductor manufacturing industry with experience as;

• AOI process support (recipe creation, machine operation and basic troubleshooting)
• Hands‑on experience with Camtek AOI systems (highly preferred)
• Direct exposure to PLP or CSP / fine‑pitch package manufacturing is required

Technical Competencies

Strong understanding of:

• CSP assembly process flow
• Solder bump and die attach defect mechanisms
• Vision‑based inspection fundamental

Ability to read and interpret:

• Package drawings
• Substrate layouts
• Inspection specification documents

Soft Skills & Behavioral Competencies

• High attention to detail and defect sensitivity
• Strong analytical and troubleshooting skills
• Effective cross‑functional communication
• Ability to work under production pressure and shift schedules
• Continuous improvement and quality‑first mindset

Travel Time:

0% - 25%

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.