YT-Asia YE DRAM Physical Failure Analysis (PFA) Engineer

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

F15 YT-Asia YE PFA は、Micronの DRAM テクノロジー ロードマップをサポートし、現在および将来の DRAM テクノロジーの開発へ、故障解析により貢献する役割を担っています。 この度、Micronでは次世代DRAM、HBMテクノロジー開発向けのプロジェクトのメンバーとして、初期開発から量産レベルを達成するためのデバイス開発を担当していただく故障解析(PFA)エンジニアを募集します。　故障解析エンジニアは、開発時に起こりうる故障や形状の不具合を早期に発見して、その結果を早期にフィードバックしてデバイスの特性を改善しなければなりません。　私たちは問題の解決に情熱を持ち、より良い方向に状況を好転させていく熱心なエンジニアを必要としています。

次世代製品の構造の理解と共に、TEM、FIB、SEM、発光解析などの技術を用いて故障個所を特定し、デバイスの歩留まり向上に貢献して頂きます。また、インテグレーションチーム、プロセスチーム、DRAMエンジニアリンググループと緊密に連携して頂くことを期待しています。

このポジションで成功するには、標準的な TEM、FIB、SEM、発光解析などの知識/経験/スキル、半導体製造工程の基本的なプロセスの理解、および半導体デバイスの知識があることが推奨されます。 また、TEMサンプルの作成方法や故障ビットのビットカウントの方法や、解析およびデータ分析ツールに通じているかたを歓迎します。チームの同僚やマネージャーとの協業を通じて、良い結果を達成できることを期待しています。 半導体デバイスの一般的な知識とプロセスインテグレーション・デバイス開発に関連する知識と共に、最先端のDRAM開発エンジニアとして、優れたコミュニケーションスキルと分野横断的な能力を発揮することを期待しています。

期待される責務 (目安として)

• TEM、FIB、SEMを用いて、故障原因を特定できる正確な画像および元素分析データを取得して頂きます

• 正確なデータを取得するため、レイアウトおよび構造を理解し故障部へアプローチします

• サンプル作成方法の改善や観察/分析条件の検討などを行い、継続的に技術改善と品質向上を図ります

• YEエンジニアとコミュニケーションを図り、予想される故障の理解と、解析データの共有を行います

• 高品質な解析結果をインテグレーションチームへ提供し、早期歩留まり向上に貢献して頂きます

• 解析装置の保守、メインテナンスも、チームメンバーと協業して実施して頂きます 

・F15 YT-Asia YE PFAでの職務を、長期に渡り継続して遂行して頂きたい

求められる資格 (目安として)

• 半導体製造工程の基本的なプロセスの理解

• DRAMのレイアウトや構造を理解できる能力

• DRAMやCMOSトランジスタの動作原理の理解

• TEM、FIB、SEMを用いた故障解析の経験のある方

• 故障解析に興味があり、解析結果からまた次の解析結果の更なる改善に繋げていこうという、向上心と意欲のある方を歓迎します

• 日本語、英語を用いた優れたコミュニケーションスキル

• 優れた日本語、英語によるプレゼンテーションスキル

GJS:

・E2以上

YT-Asia YE DRAM Physical Failure Analysis (PFA) Engineer

The F15 YT-Asia YE PFA is responsible for supporting Micron's DRAM technology roadmap and contributing to the development of current and future DRAM technologies through failure analysis. Micron is currently looking for a Physical Failure Analysis (PFA) Engineer who will be in charge of device development from initial development to high volume manufacturing level as a member of a project for the development of next-generation DRAM and HBM technologies. We need an enthusiastic engineer who is passionate about solving issues and turning things around for the better. Failure Analysis Engineers have to identify possible failures and geometry anomalies during development and provide early feedback on the results to improve device characteristics.

Along with understanding the structure of next-generation products, you will use techniques such as TEM, FIB, SEM, and Emission analysis to identify failure locations and contribute to improving device yields. You will also be expected to work closely with the Integration Team, Process Team, and DRAM Engineering Group.

To be successful in this position, knowledge/experience/skills in standard TEM, FIB, SEM, and Emission analysis, an understanding of basic semiconductor manufacturing processes, and knowledge of semiconductor devices is recommended. We also expect you to be skilled in TEM sample preparation methods, methods for bit counting of failed bits, and physical failure analysis and data analysis tools. We expect you to achieve good results through collaboration with your team colleagues and managers. We expect you to demonstrate excellent communication skills and cross-disciplinary abilities as a state-of-the-art DRAM development engineer related to process integration device development with general knowledge of semiconductor devices.

Responsibilities include, but not limited to:

• Acquire accurate images and elemental analysis data using TEM, FIB, and SEM to identify the cause of failures.
• Understand layout and structure and approach the failure areas to obtain accurate data.
• Continuously improve techniques and quality by improving sample preparation methods and examining observation/analysis conditions.
• Communicate with YE engineers to understand expected failures and share analysis data.
• Provide high quality analysis results to the integration team and contribute to early yield improvement.
• Maintain the analysis equipment in collaboration with team members.
• Continue performing your duties at F15 YT-Asia YE PFA for the long term.

Minimum Qualifications:

• Understanding of basic semiconductor manufacturing processes
• Capability to understand DRAM layouts and structures
• Understanding of the operating principles of DRAM and CMOS transistors
• Experience in failure analysis using TEM, FIB, and SEM
• Interested in failure analysis, and able to use the results of analysis to improve the next analysis, with ambition and motivation
• Excellent communication skills in Japanese and English
• Excellent presentation skills in Japanese and English

GJS:

• E2 and above

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_japan@micron.com

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