About the role
About the Team:
OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.
Role Overview
We are seeking an experienced engineer to lead the development of advanced packaging technologies that enable next-generation, high-performance compute systems. This role sits at the intersection of chip architecture, package integration, and manufacturing scale-up, driving breakthroughs in performance, power, thermal, and reliability. The ideal candidate brings deep expertise in 2.5D and 3.5D large-reticle integration and Co-Packaged Optics (CPO) packaging, with a proven ability to translate advanced concepts into qualified, high-volume production solutions.
In this role you will:
Architect, develop, and prototype advanced packaging solutions (2.5D/3D integration, large-format interposers/bridges, high-density substrates, advanced assembly flows), and drive end-to-end qualification for high-volume production.
Develop packaging concepts and requirements to support CPO packaging, including optical/electrical co-integration considerations, thermal/mechanical constraints, and high-volume manufacturability.
Lead large-reticle and multi-die integration strategies, including mechanical/thermal co-design, warpage control, and yield/reliability risk mitigation across package scale-up.
Identify and solve fundamental technical challenges in package architecture, integration, and manufacturability for high-performance compute chips.
Collaborate closely with cross-functional teams (silicon architecture, SI/PI, thermal, mechanical, system, test, and manufacturing) to align package development with product requirements and program milestones.
Drive vendor engagement and technical alignment with external partners (foundry/OSAT/material/tool vendors), including technology selection, DOE planning, and qualification readiness.
You might thrive in this role if you have:
Large-reticle / large-body-size integration, including interposer/bridge-based architectures, package-scale mechanical/thermal risk management, and manufacturability at scale.
Hands-on experience with CPO packaging, including package-level optical integration constraints and cross-domain trade-offs (electrical/optical/thermal/mechanical).
Proven track record developing and productizing large-format, high-power, high-speed advanced packaging technologies for high-performance compute products.
In-depth expertise across advanced packaging techniques and platforms used in the semiconductor industry (2.5D, 3D stacking, interposers/bridges, high-density substrates, advanced materials and assembly).
Strong understanding of chip–package co-design: how chip architecture, I/O, power delivery, and floorplan decisions interact with packaging architecture and constraints.
Preferred Qualifications
Solid understanding of thermal and mechanical interactions in large-format packages (warpage, stress, lid/heat-spreader/cold-plate interfaces, material interactions).
Working knowledge of reliability requirements and qualification methodologies for advanced packages (JEDEC/industry practices, failure analysis, DOE-driven learning cycles).
Familiarity with system-level considerations and chip architecture fundamentals (I/O topology, HBM/advanced memory integration, SI/PI constraints, module-to-system integration).
To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations.
About OpenAI
OpenAI is an AI research and deployment company dedicated to ensuring that general-purpose arti
Aplyr's read
OpenAI is a pioneering AI research organization focused on developing AGI to benefit humanity, attracting talent keen on ethical and innovative AI solutions.
What's promising
- •OpenAI is at the forefront of AI research, driving innovation in artificial general intelligence.
- •The company emphasizes ethical AI development, appealing to those passionate about responsible technology.
- •OpenAI offers diverse roles across engineering, sales, and creative fields, indicating a dynamic work environment.
What to watch
- •OpenAI's rapid growth may lead to organizational challenges and resource strain.
- •The focus on AGI poses inherent risks and ethical dilemmas that require careful navigation.
- •Limited public information about internal culture and work-life balance may concern potential applicants.
Why OpenAI
- •OpenAI's mission to ensure AGI benefits all of humanity sets it apart in the tech industry.
- •The organization combines cutting-edge research with a strong emphasis on ethical AI practices.
- •OpenAI's diverse hiring across global markets reflects its commitment to international impact and collaboration.
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About OpenAI
OpenAI is an artificial intelligence research organization that aims to ensure that artificial general intelligence (AGI) benefits all of humanity. They develop advanced AI technologies and promote safe and responsible AI practices.
